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  • BYK-9076

    Solvent-free wetting and dispersing additive for solvent-borne and solvent-free coating systems, PVC plastisols, thermoplastics, and adhesives to stabilise organic and inorganic pigments, particularly carbon blacks.

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  • BYK-9077

    Solvent-free wetting and dispersing additive for solvent-free coating systems, PVC plastisols, and thermoplastics.

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  • BYK-9077

    Solvent-free wetting and dispersing additive for solvent-borne and solvent-free coatings and solvent-free UV printing inks. Particularly recommended for basic carbon black pigments.

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  • BYK-A 500

    Silicone-free air release additive for unsaturated polyester resins as well as polyurethane and epoxy systems; particularly recommended for transparent systems. Also suitable for epoxy floorings.

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  • BYK-A 501

    Silicone-free air release additive for unsaturated polyester resins and particularly for polyurethane and epoxy systems.

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  • BYK-A 505

    Silicone-free polymer air release agent based on renewable resources intended for unsaturated polyester resins as well as solvent-borne and solvent-free systems.

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  • BYK-A 525

    Defoamer/air release agent for potting compounds, sealants and adhesives (polyurethane and epoxy). Contains silicone.

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  • BYK-A 530

    Silicone polymer air release additive for solvent-free and solvent-borne epoxy systems and adhesives with good air-releasing and defoaming effects.

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  • BYK-A 530

    Silicone and polymer-containing defoamer/air release additive for solvent-borne and solvent-free coatings.

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  • BYK-A 535

    Silicone-free air release additive for solvent-free and solvent-borne epoxy and PUR systems as well as adhesives.

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  • BYK-C 8000

    Reactive, polymeric coupling agent (adhesion promoter) to improve mechanical properties in radical curing systems. In solvent-borne and solvent-free coatings, the additive acts as an adhesion promoter on metal and glass.

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  • BYK-CATALYST 450

    Blocked catalyst for aqueous and solvent-borne coatings. Accelerates cross-linking of amino resins with resins containing hydroxyl groups. Lowers baking temperature and time.

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